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Independent 3 Heating Zones Manual BGA Rework Machine WDS 520 for 10mm PCB

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Independent 3 Heating Zones Manual BGA Rework Machine WDS 520 for 10mm PCB

Brand Name : WDS

Model Number : WDS-520

Certification : CE

Place of Origin : China

MOQ : 1 UNIT

Payment Terms : T/T, Western Union, MoneyGram

Supply Ability : 150 UNITS PER MONTH

Delivery Time : 8-15 working days

Packaging Details : Wooden case

Suitable fo size : Min 10*10mm

sizeApplicable chip : Max 60*60mm

Applicable chip : Min 1*1mm

Applicable PCB thickness : 0.3-5mm

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Independent 3 heating zones Manual BGA Rework Station WDS-520

Product Description

  • Our BGA Rework Station/BGA reballing station are widely used to replace and repair the BGA chip in laptop , mobile phone , xbox 360, ps3,etc.
  • The main user is repairing shops and factory to provide the after-sales service and rework.

Manual BGA Rework Station

Model:WDS-520

  1. Repair Success Rate:More Than 99%
  2. Using The Industriak Touche Screen
  3. Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat.(temperature accuracy ± 2°C)
  4. With CE Certification

Main Features

Operation System

  • Manual mode.
  • Can solder, desolder, mount, pick and replace chip.
  • User-friendly.

Strict Temperature Control System

  • 8 segments rising temperature/constant time/ temperature rising slope, it can save hundreds of groups temperature curve.
  • It adopts high accuracy K-type thermocouple close-loop control.
  • The external sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately at any time.

Safety Sustem

  • With CE cetification
  • With automatic power-off protection device when abnormal accident happens and double over-temp protection fuction.
Power supply AC 220V ± 10% 50Hz
Total power 3800W
Heater power Upper temp.zone 800W, second temp.zone 1200W, IR temp.zone 1800W(1200W controlled)
Electrical material Touch screen+Temperature control module+ microcontrollers
Locating way V-shape card slot + Universal jigs
PCB size Max 300mm*280mm Min 10mm*10mm
Applicable chips Max 60mm*60mm Min 1mm*1mm
PCB thickness 0 .3-5mm
Overall dimension L460mm*W480mm*H500mm
Weight of machine About 30KG
Usage Repair chips/phone motherboard etc.


Product Tags:

3 Heating Zones BGA Rework Machine

      

WDS 520 BGA Rework Machine

      

3 Heating Zones WDS BGA

      
Cheap Independent 3 Heating Zones Manual BGA Rework Machine WDS 520 for 10mm PCB for sale

Independent 3 Heating Zones Manual BGA Rework Machine WDS 520 for 10mm PCB Images

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